International Standard
ISO 9455-18
Soft soldering fluxes — Test methods — Part 18: Cleanliness of soldered printed circuit assemblies before and/or after cleaning
Reference number
ISO 9455-18
Edition 1
2024-08
© ISO 2024
Under publication
Under publication (Edition 1, 2024)
Final production steps (up to seven weeks).

Abstract

This part of ISO 9455 specifies test methods of cleanliness of the Soldered Printed Circuit Assemblies before and/or after cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.

General information

  • Status
     : Under development
    Publication date
     : 2024-08
    Stage
    : International Standard under publication [60.00]
  • Edition
     : 1
  • Technical Committee :
    ISO/TC 44/SC 12
    ICS :
    25.160.50 
  • RSS updates

Life cycle

Sustainable Development Goals

This standard contributes to the following Sustainable Development Goal

9
Industry, Innovation and Infrastructure

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