Reference number
ISO/TS 10303-1716:2010
© ISO 2024
Technical Specification
ISO/TS 10303-1716:2010
Industrial automation systems and integration — Product data representation and exchange — Part 1716: Application module: Layered interconnect complex template
Edition 3
2010-07
Withdrawn
Withdrawn (Edition 3, 2010)

Abstract

ISO/TS 10303-1716:2010-07 specifies the application module for Layered interconnect complex template.

The following are within the scope of ISO/TS 10303-1716:2010-07:

  • footprint definition;
  • footprint definition shape;
  • padstack definition;
  • padstack definition shape;
  • items within the scope of application module Layered interconnect simple template, ISO/TS 10303-1718;
  • items within the scope of application module Physical unit 2d shape, ISO/TS 10303-1726.

General information

  • Status
     : Withdrawn
    Publication date
     : 2010-07
    Stage
    : Withdrawal of International Standard [95.99]
  • Edition
     : 3
    Number of pages
     : 8
  • Technical Committee :
    ISO/TC 184/SC 4
    ICS :
    25.040.40 
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