Résumé
ISO/TS 10303-1685:2014-02 specifies the application module for Interconnect module to assembly module relationship.
The following are within the scope of ISO/TS 10303-1685:2014-02:
- assembly requirement for interconnect substrate;
- assembly component based symbol placement in substrate requirement;
- assembly component based annotation text placement in substrate requirement;
- assembly component feature to layout feature requirement relationship;
- external references for assembly component;
- external references for assembly component feature;
Informations générales
-
État actuel: AnnuléeDate de publication: 2014-06Stade: Annulation de la Norme internationale [95.99]
-
Edition: 3
-
Comité technique :ISO/TC 184/SC 4ICS :25.040.40
- RSS mises à jour
Cycle de vie
-
Précédemment
AnnuléeISO/TS 10303-1685:2010
-
Actuellement
-
Révisée par
PubliéeISO/TS 10303-1685:2018