Abstract
PreviewISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
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Status: Under development
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Edition: 2Number of pages: 19
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- ICS :
- 25.160.50 Brazing and soldering
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en
| Format | Language | |
|---|---|---|
| std 1 61 | ||
| std 2 61 | Paper |
- CHF61
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