Reference number
ISO/TS 10303-1754:2010
© ISO 2024
Technical Specification
ISO/TS 10303-1754:2010
Industrial automation systems and integration — Product data representation and exchange — Part 1754: Application module: Via component
Edition 2
2010-03
Technical Specification
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Published (Edition 2, 2010)
This publication was last reviewed and confirmed in 2022. Therefore this version remains current.

Abstract

ISO/TS 10303-1754:2010-03 specifies the application module for Via component.

The following are within the scope of ISO/TS 10303-1754:2010-03:

  • blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed;
  • cylinder vias, where the cross-section shape is constant;
  • tapered vias, where the cross-section shape may vary as the vertical distance changes;
  • stacked vias, where multiple bind and buried vias share the same x y position;
  • filled vias, where material may be inserted into the via during realization processes, which are within the scope of application module Layered interconnect module design, ISO/TS 10303-1698;
  • buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed;
  • interfacial connections, also known as through hole vias, which have both ends exposed;
  • items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684;
  • items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.

General information

  • Status
     : Published
    Publication date
     : 2010-03
    Stage
    : International Standard confirmed [90.93]
  • Edition
     : 2
    Number of pages
     : 8
  • Technical Committee :
    ISO/TC 184/SC 4
    ICS :
    25.040.40 
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Cover page: STEP Module and Resource Library (SMRL) v10
STEP Module and Resource Library (SMRL) v10
This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …

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