ISO/TS 10303-1688:2006 - Industrial automation systems and integration — Product data representation and exchange — Part 1688: Application module: Interconnect non planar shape

Withdrawn (Edition 1, 2006)

New version available: ISO/TS 10303-1688:2010

Abstract

ISO/TS 10303-1688:2006 specifies the application module for Interconnect non planar shape.

The following are within the scope of ISO/TS 10303-1688:2006:

three dimensional manifold surface representation of an interconnect substrate;
placement of footprint and other planar feature definitions in a three dimensional manifold surface representation including changing the planar shape to a manifold shape.

General information

Status
: Withdrawn

Publication date
: 2006-12

Stage
: Withdrawal of International Standard [95.99]
Edition
: 1

Number of pages
: 40
Technical Committee :
ISO/TC 184/SC 4

ICS :
25.040.40
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