Abstract
ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:
- tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
- tin-antimony;
- tin-bismuth;
- tin-copper, with and without silver;
- tin-indium, with and without silver and bismuth;
- tin-silver, with and without copper and bismuth;
- tin-zinc, with and without bismuth.
ISO 9453:2006 also includes an indication of the forms generally available.
General information
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Status: WithdrawnPublication date: 2006-10Stage: Withdrawal of International Standard [95.99]
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Edition: 2Number of pages: 10
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Technical Committee :ISO/TC 44/SC 12ICS :25.160.50
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Life cycle
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Previously
WithdrawnISO 9453:1990
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Now
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Revised by
WithdrawnISO 9453:2014
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