Résumé
ISO/TS 10303-1698:2010-03 specifies the application module for Layered interconnect module design.
The following are within the scope of ISO/TS 10303-1698:2010-03:
- design features;
- material stackup;
- design patterns;
- metalization;
- functional and physical network listing;
- design layers;
- artwork layers;
- passages;
- items within the scope of application module Assembly component placement requirements, ISO/TS 10303-1634;
- items within the scope of application module Component grouping, ISO/TS 10303-1656;
- items within the scope of application module Edge shape feature, ISO/TS 10303-1673;
- items within the scope of application module Footprint definition, ISO/TS 10303-1646;
- items within the scope of application module Land, ISO/TS 10303-1692;
- items within the scope of application module Layered interconnect module with printed component design, ISO/TS 10303-1700.
Informations générales
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État actuel: AnnuléeDate de publication: 2010-03Stade: Annulation de la Norme internationale [95.99]
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Edition: 2
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Comité technique :ISO/TC 184/SC 4ICS :25.040.40
- RSS mises à jour
Cycle de vie
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Précédemment
AnnuléeISO/TS 10303-1698:2006
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Actuellement
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Révisée par
AnnuléeISO/TS 10303-1698:2010