Résumé
ISO/TS 10303-1688:2006 specifies the application module for Interconnect non planar shape.
The following are within the scope of ISO/TS 10303-1688:2006:
- three dimensional manifold surface representation of an interconnect substrate;
- placement of footprint and other planar feature definitions in a three dimensional manifold surface representation including changing the planar shape to a manifold shape.
Informations générales
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État actuel: AnnuléeDate de publication: 2006-12Stade: Annulation de la Norme internationale [95.99]
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Edition: 1
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Comité technique :ISO/TC 184/SC 4ICS :25.040.40
- RSS mises à jour
Cycle de vie
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Actuellement
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Révisée par
PubliéeISO/TS 10303-1688:2010