ISO/TS 10303-1698:2014

Retirada (Edición 4, 2014)

Nueva versión disponible:

Resumen

ISO/TS 10303-1698:2014-02 specifies the application module for Layered interconnect module design.

The following are within the scope of ISO/TS 10303-1698:2014-02:

design features;
material stackup;
design patterns;
metalization;
functional and physical network listing;
design layers;
artwork layers;
passages;
items within the scope of application module Assembly component placement requirements, ISO/TS 10303-1634;
items within the scope of application module Component grouping, ISO/TS 10303-1656;
items within the scope of application module Edge shape feature, ISO/TS 10303-1673;
items within the scope of application module Footprint definition, ISO/TS 10303-1646;
items within the scope of application module Land, ISO/TS 10303-1692;
items within the scope of application module Layered interconnect module with printed component design, ISO/TS 10303-1700.