Reference number
ISO/TS 10303-1688:2010
Technical Specification
ISO/TS 10303-1688:2010
Industrial automation systems and integration — Product data representation and exchange — Part 1688: Application module: Interconnect non planar shape
Edition 2
2010-03
Technical Specification
Preview
ISO/TS 10303-1688:2010
56332
No disponible en español
Publicado (Edición 2, 2010)
Esta publicación se revisó y confirmó por última vez en 2022. Por lo tanto, esta versión es la actual.

Resumen

ISO/TS 10303-1688:2010-03 specifies the application module for Interconnect non planar shape.

The following are within the scope of ISO/TS 10303-1688:2010-03:

  • three dimensional manifold surface representation of an interconnect substrate;
  • placement of footprint and other planar feature definitions in a three dimensional manifold surface representation including changing the planar shape to a manifold shape.

Informaciones generales

  •  : Publicado
     : 2010-03
    : Norma Internacional confirmada [90.93]
  •  : 2
     : 8
  • ISO/TC 184/SC 4
    25.040.40 
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This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …

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