This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …
Resumen
ISO/TS 10303-1688:2010-03 specifies the application module for Interconnect non planar shape.
The following are within the scope of ISO/TS 10303-1688:2010-03:
- three dimensional manifold surface representation of an interconnect substrate;
- placement of footprint and other planar feature definitions in a three dimensional manifold surface representation including changing the planar shape to a manifold shape.
Informaciones generales
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Estado: PublicadoFecha de publicación: 2010-03Etapa: Norma Internacional confirmada [90.93]
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Edición: 2Número de páginas: 8
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Comité Técnico :ISO/TC 184/SC 4ICS :25.040.40
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Ciclo de vida
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Anteriormente
RetiradaISO/TS 10303-1688:2006
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Ahora